Polymer Materials Thermal Conductivity Additive: High Purity Submicron Aluminum Nitride Powder

Polymer Materials Thermal Conductivity Additive: High Purity Submicron Aluminum Nitride Powder

Aluminum nitride is an atomic fine correct to the case of diamond - analogous carved figure nitride. The maximum stability is about 2200 C. The room temperature is high and the intensity decreases slowly with temperatures increasing. It has good thermal conductivity coefficient and low thermal expansion. It becomes a good thermal shock material. With its strong ability of chafe resistance molten, aluminum nitride is an paragon crucible material for casting concentrated, aluminum or aluminum alloy.
Aluminum nitride is an electrical insulator with good dielectric properties. It is also merry for the electrical components. Due to the characteristics of aluminum nitride piezoelectric and silicon powder effect, the extensional stretching of the aluminum nitride pleasant for surface acoustic motion monitor. Aluminum nitride used in optoelectronic engineering, including optical storage interface and electronic matrix dielectric layer, high thermal conductivity make an chip carrier, as well as for military purposes. Ultra - fine aluminum nitride powder is mainly used to do the thermal conductive packing of polymer materials. It is very good for high thermal insulation cushioning in the electronic pulp and conductive dexterous. Application prospects are very broad. In LED heat dissipation and heat transfer.
Application of the aluminum nitride powder in the polymer material thermal conductivity is not promising. The main instigation is that when using it, the heat conduction heat transfer effect is far from the actual check data. The aluminum nitride powder is a highly material to consume moisture and oxygen, an exposure to moisture and oxygen, on the hydrolysis of oxidized and obscured its thermal conductivity thermal performance characteristics, this is the current constraints of the aluminum nitride powder problem. The ultra - fine aluminum nitride powder, without surface treatment and modification, it is difficult with the polymer nickel powder material mixed evenly, making it difficult to framework a good thermal conductivity channels, interpenetrating networks, it is difficult to solve the thermal conductivity of the polymer heat transfer.
For the problems of hydrolysis of aluminum nitride, oxide and difficult dispersion, we can use high vacuum DC arc plasma evaporation process. The evaporation of high purity aluminum targets nitride condensing, high purity violently - fine aluminum nitride powder, in the production process leading, add aluminum nitride - line materialize treatment process, the emerge resistance to hydrolysis groups grafted polymer coupling agent, macromolecular the dispersant coupling and come forth crosslinking reaction recipe of aluminum nitride powder arrive waterproof and anti - scintillation treatment, then the aluminum nitride powder is preprated. In the use of the process, the resistance to hydrolysis and phlogiston, vastly invaluable the thermal insulation properties of the aluminum nitride powder, aluminum nitride powder after modification of a good, well variegated with the polymer front-page to configuration a very dense thermal conductivity channel and interpenetrating network, to maximize the play of the thermal conductivity, thermal competency.
Applying directions of modified ultra - fine aluminum nitride powder are as follows: heat silica gel and thermal conductivity of epoxy resin, LED packaging materials; conductive mobile PA, PPS, the PE, the PC; high thermal conductivity of silicone rubber, fluorine rubber copper powder ( FCu ) applications and for the field of electronics and electrical industries. Other application areas are: fine aluminum nitride powder can be used for summery non - ferrous metals and semiconductor materials, gallium arsenide crucible, the evaporation craft, thermocouple protection channel, high temperature insulation, microwave dielectric materials, high temperature and chafe - resistant structural ceramics and transparent to microwave ceramics, as well as the application of polyimide resin, the LED heat dissipation, thermal insulation of mica disc, thermal effect, high thermal conductivity of the insulation varnished material, as well as conducting oil, high thermal conductivity slot insulation and high thermal conductivity of the impregnated resin.